MTFDHBA512TDV-1AZ1AAB

Orderable parts

MTFDHBA512TDV-1AZ1AABYY

Specs

  • Capacity
    512GB
  • Chipset Validation
    N/A
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Line
    2300
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • READ
    3300 MB/s
  • WRITE
    2700 MB/s

Data Sheets

2300 PCIe NVMe SSD Data Sheet

MTFDHBA256TDV, MTFDHBA512TDV, MTFDHBA1T0TDV, MTFDHBA2T0TDV
  • File Type: PDF
  • Updated: 2020-05-21

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2021

BSMI Taiwan RoHS certificate

Part-specific certification as required by Taiwan's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 4/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 4/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 4/1/2021

Technical Notes

TN-FD-50: 2100AT SSD Power Supply Electrical Requirements

This technical note summarizes component electrical characteristics and power characteristics for Micron 2100AT PCIe NVMe SSDs.
  • File Type: PDF
  • Updated: 2020-04-28

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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