MT25QU01GBBB8ESF-0SIT

Orderable parts

MT25QU01GBBB8ESF-0SIT

Specs

  • Chipset Validation
    N/A
  • Density
    1Gb
  • FBGA Code
    RW192
  • Media
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Type
    Stacked
  • Width
    x1/x2/x4

Data Sheets

MT25Q, 2Gb, 1.8V Multiple I/O Serial Flash Memory Data Sheet

MT25Q is a high-performance multiple input/output, 2Gb, 1.8V, SPI Flash memory device; MT25QU02GCBB
  • File Type: PDF
  • Updated: 2019-05-15

MT25Q, 1Gb, 1.8V Multiple I/O Serial Flash Memory Data Sheet

MT25Q is a high-performance multiple input/output, 1Gb, 1.8V, SPI Flash memory device; MT25QU01GBBB
  • File Type: PDF
  • Updated: 2018-06-05

MT25Q Devices: Multiple I/O Serial Flash Memory Electrical Addendum

DC Characteristics; VIH and VIL
  • File Type: PDF
  • Updated: 2018-09-19

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 8/1/2021

Simulation Models

IBIS_MT25QU01GBBBxxPP-xxTT v2.2

PP= 12, SF, W9. TT= IT, AT, AUT.
  • File Type: ZIP
  • Updated: 2017-09-25

MT25Q_1Gb_1.8V_64KB_MicronXIP_Reset_RevB_Standard_VG1.2.tar

Verilog model, Standard model, MT25QU01GBBB8Epp-0
  • File Type: GZ
  • Updated: 2019-03-27

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-25-09: Layout Guidelines - Serial NOR Flash

This technical note provides PCB designers basic guidelines for optimizing signal layout and power supply lines in Micron's Serial NOR Flash device to prevent signal integrity problems.
  • File Type: PDF
  • Updated: 2016-07-11
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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