MT25QL128ABA8ESF-0SIT

Orderable parts

MT25QL128ABA8ESF-0SIT

Specs

  • Chipset Validation
    N/A
  • Density
    128Mb
  • FBGA Code
    RW207
  • Media
    Tray, Tape & Reel
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    Yes
  • Product Longevity Program Start Date
    5/4/2011
  • Type
    Multi I/O
  • Width
    x1/x2/x4

Data Sheets

MT25Q 128Mb, 3V, Multiple I/O Serial Flash Memory MT25QL128ABA

MT25QL128ABA is a high-performance multiple input/output, 128Mb, 3V, SPI Flash memory device.
  • File Type: PDF
  • Updated: 2019-04-26

MT25Q Devices: Multiple I/O Serial Flash Memory Electrical Addendum

DC Characteristics; VIH and VIL
  • File Type: PDF
  • Updated: 2018-09-19

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 8/1/2022

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 8/1/2022

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 8/1/2022

Simulation Models

IBIS_MT25QL128ABAxxPP-xxTT v2.7

PP= 12, 14, SE, SF, W7, W9. TT= IT, AT.
  • File Type: ZIP
  • Updated: 2019-03-06

MT25Q_128Mb_3V_64KB_MicronXIP_Reset_VG13

Verilog model MT25QL128ABA8E0
  • File Type: GZ
  • Updated: 2019-03-22

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-12-30: NOR Flash Cycling Endurance and Data Retention

This technical note defines the industry standards for this testing, Micron's NOR Flash testing methodology, and the two key metrics used to measure NOR device failure: cycling endurance and data retention.
  • File Type: PDF
  • Updated: 2017-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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