MT29F1G08ABAFAWP-ITE

Orderable parts

MT29F1G08ABAFAWP-ITE:F

Specs

  • Chipset Validation
    N/A
  • Density
    1Gb
  • FBGA Code
    N/A
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

1Gb x8 1.8V and 3V M78A ECC on NAND Flash Memory Data Sheet

MT29F1G08ABAFAWP-ITE:F, MT29F1G08ABAFAH4-ITE:F, MT29F1G08ABBFAH4-ITE:F
  • File Type: PDF
  • Updated: 2019-07-14

RoHS

China RoHS Certificate

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.
  • File Type: (PDF)
  • Updated: 7/1/2021

RoHS Certificate of Compliance

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.
  • File Type: (PDF)
  • Updated: 7/1/2021

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 7/1/2021

Simulation Models

HSpice: NAND 1G SLC M78A

Rev 2.0, MT29F1G08ABAFAH4-ITE:F, MT29F1G08ABAFAWP-ITE:F, MT29F1G08ABBFAH4-ITE:F, MT29F1G08ABAFAWP-AAT:F
  • File Type: ZIP
  • Updated: 2019-03-25

IBIS: NAND 1Gb SLC M78A

Rev 2.0, MT29F1G08ABAFAH4-ITE:F, MT29F1G08ABAFAWP-ITE:F, MT29F1G08ABBFAH4-ITE:F, MT29F1G08ABAFAWP-AAT:F
  • File Type: ZIP
  • Updated: 2019-03-25

Technical Notes

TN-29-68: One-Time Programmable Operations in 2Gb: x8, x16 NAND Flash Memory

This technical note describes one-time programmable operations in Micron's 2Gb: x8, x16 NAND Flash memory devices.
  • File Type: PDF
  • Updated: 2016-08-16

TN-29-52: Migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC NAND Flash Memory to 34nm

This technical note provides guidelines for migrating 1Gb 48nm and 2Gb/4Gb 57nm SLC, large-page NAND Flash memory to 34nm technology (M60A, M69A & M68A)
  • File Type: PDF
  • Updated: 2015-09-22
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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