MTFC32GAPALBH-IT

Orderable parts

MTFC32GAPALBH-IT

Specs

  • Chipset Validation
    N/A
  • Density
    32GB
  • FBGA Code
    JZ132
  • Op. Temp.
    -40C to +85C
  • Part Status
    Production
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • Width
    x8

Data Sheets

8GB, 16GB, 32GB, 64GB, 128GB, e.MMC v5.1, 153-ball TFBGA (Industrial) Data Sheet

MTFC8GAMALBH-IT, MTFC16GAPALBH-IT, MTFC32GAPALBH-IT, MTFC64GAPALBH-IT, MTFC128GAPALNS-IT
  • File Type: PDF
  • Updated: 2020-05-21

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 10/1/2021

Simulation Models

IBIS embedded IT eMMC 5.1 (PS8226) - rev 1.8

MTFC8GAMALBH-AIT, MTFC8GAMALNA-AIT, MTFC16GAPALBH-AIT, MTFC16GAPALNA-AIT, MTFC32GAPALBH-AIT, MTFC32GAPALNA-AIT, MTFC64GAPALBH-AIT, MTFC64GAPALNA-AIT, MTFC128GAPALNS-AIT, MTFC128GAPALNA-AIT, MTFC16GAPALBH-IT, MTFC32GAPALBH-IT, MTFC64GAPALBH-IT, MTFC128GAPALNS-IT
  • File Type: ZIP
  • Updated: 2020-05-12

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-29-85: UFS Memory Health Report for Mobile Devices

This technical note describes how to obtain the health report information for Micron's UFS devices.
  • File Type: PDF
  • Updated: 2019-05-10
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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