MT41K128M8DA-107 AIT

Orderable parts

MT41K128M8DA-107 AIT:J

Specs

  • Chipset Validation
    N/A
  • Data Rate
    DDR3-1866
  • Density
    1Gb
  • FBGA Code
    D9SGG
  • Features
  • Op. Temp.
    -40C to +95C
  • Part Status
    Obsolete
  • Product Longevity Program
    Yes
  • Product Longevity Program Start Date
    5/4/2011
  • Width
    x8

Data Sheets

1Gb: x8, x16 Automotive DDR3L SDRAM

MT41K128M8 – 16 Meg x 8 x 8 banks, MT41K64M16 – 8 Meg x 16 x 8 banks
  • File Type: PDF
  • Updated: 2018-05-20

1Gb: x8, x16 Automotive DDR3L SDRAM Addendum (V88A)

MT41K128M8 – 16 Meg x 8 x 8 banks, MT41K64M16 – 8 Meg x 16 x 8 banks
  • File Type: PDF
  • Updated: 2018-05-20

Simulation Models

HSpice

Version 2.3 (for die rev. J); V88A; MT41K64M16TW-107 AUT:J
  • File Type: ZIP
  • Updated: 2016-09-12

IBIS

Version 2.1 (for die rev. J); V88A; MT41K64M16TW-107 AUT:J
  • File Type: ZIP
  • Updated: 2018-08-30

DDR3 SDRAM Verilog Model

1.74
  • File Type: ZIP
  • Updated: 2015-09-10

Technical Notes

TN-00-08: Thermal Applications

This document describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2020-03-25

TN-00-07: IBIS Behavioral Models

Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site.
  • File Type: PDF
  • Updated: 2009-11-15
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Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2020-10-13

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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